Dicing PO Film
It is attached to the back side of the wafer to hold the wafer while cutting, and is a back film used for automatic processing by floating at regular intervals after cutting. Contamination is minimized by extruding in a cleanroom facility, and phthalate, a problem in PVC, is not detected by using Polyolefine material.
- Produced in clean areas ( Class 100 )
- Used for processes requiring minimal burr generation
- Securing excellent mechanical properties
- Optimized size and specifications for customer convenience can be produced
- Softness Film & Heat Resistance
- Excellent heat resistance despite its soft properties
- Excellent heat resistance compared to general elasteomer
- 1% level shrinkage based on 120℃ hot plate (2min)
- Products with improved heat resistance compared to our own PO film
Technical
Data
Related
Products
Along with the product you have chosen, we will guide you through the products that others have chosen.
Check out more products on the left and right slides
